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AN816
Vishay Siliconix
Dual-Channel LITTLE FOOT R 6-Pin SC-70 MOSFET
Copper Leadframe Version
Recommended Pad Pattern and Thermal Performance
INTRODUCTION
26 (mil)
87 (mil)
The new dual 6-pin SC-70 package with a copper leadframe
enables improved on-resistance values and enhanced
thermal performance as compared to the existing 3-pin and
6-pin packages with Alloy 42 leadframes. These devices are
intended for small to medium load applications where a
miniaturized package is required. Devices in this package
come in a range of on-resistance values, in n-channel and
p-channel versions. This technical note discusses pin-outs,
package outlines, pad patterns, evaluation board layout, and
thermal performance for the dual-channel version.
96 (mil)
71 (mil)
23 (mil)
6
5
4
48 (mil)
61 (mil)
PIN-OUT
0.0 (mil)
1
2
3
Figure 1 shows the pin-out description and Pin 1 identification
for the dual-channel SC-70 device in the 6-pin configuration.
Both n-and p-channel devices are available in this package –
the drawing example below illustrates the p-channel device.
8 (mil)
26 (mil)
16 (mil)
SOT-363
SC-70 (6-LEADS)
FIGURE 2.
SC-70 (6 leads) Dual
S 1
G 1
1
2
6
5
D 1
G 2
EVALUATION BOARD FOR THE DUAL-
CHANNEL SC70-6
D 2
3
Top View
FIGURE 1.
4
S 2
The 6-pin SC-70 evaluation board (EVB) shown in Figure 3
measures 0.6 in. by 0.5 in. The copper pad traces are the same
as described in the previous section, Basic Pad Patterns . The
board allows for examination from the outer pins to the 6-pin
DIP connections, permitting test sockets to be used in
evaluation testing.
For package dimensions see outline drawing SC-70 (6-Leads)
( http://www.vishay.com/doc?71154 )
BASIC PAD PATTERNS
See Application Note 826, Recommended Minimum Pad
Patterns With Outline Drawing Access for Vishay Siliconix
MOSFET s, ( http://www.vishay.com/doc?72286 ) for the SC-70
6-pin basic pad layout and dimensions. This pad pattern is
sufficient for the low-power applications for which this package
is intended. Increasing the drain pad pattern (Figure 2) yields
a reduction in thermal resistance and is a preferred footprint.
Document Number: 71405
12-Dec-03
The thermal performance of the dual 6-pin SC-70 has been
measured on the EVB, comparing both the copper and Alloy
42 leadframes. This test was then repeated using the 1-inch 2
PCB with dual-side copper coating.
A helpful way of displaying the thermal performance of the
6-pin SC-70 dual copper leadframe is to compare it to the
traditional Alloy 42 version.
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相关PDF资料
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